Eliminating critical thermal failure risks in high-power RF semiconductors. We combine 3D non-linear GPU-accelerated solvers with proprietary interfacial engineering.
Standard linear EDA tools underestimate localized junction temperatures in sub-micron GaN power channels, leading to catastrophic hardware failure at tape-out.
Our proprietary GPU solver accurately captures non-linear thermal degradation and interface jump conditions in seconds across multi-finger architectures.
A proprietary nucleation interlayer recipe designed to minimize Thermal Boundary Resistance (TBR) between GaN and synthetic diamond substrates.
Protect your MMIC tape-out investment. Contact our engineering team for preliminary thermal diagnostic reports or investor deck access.
Contact Executive Team